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Nanoscaled Surface Patterning of Conducting Polymers

Identifieur interne : 002539 ( Main/Exploration ); précédent : 002538; suivant : 002540

Nanoscaled Surface Patterning of Conducting Polymers

Auteurs : Lin Jiang [Allemagne, Singapour] ; Xing Wang [Allemagne] ; Lifeng Chi [Allemagne]

Source :

RBID : ISTEX:CDE8BED65384518E846832DD45123D332E048E34

Abstract

In continuing the steady development of integrated‐circuit‐related fabrication, the ability to pattern conducting polymers into smaller and smaller sizes in order to realize devices with enhanced performance or even wholly new properties begins to take a more prominent role in their advanced applications. This review summarizes the recent advances in top‐down and bottom‐up patterning of conducting polymers on surfaces with different approaches including direct writing, in‐situ synthesis or assembly, etching, and nanoscratching. All of the latest emerging strategies have the potential to go beyond the current state of the art towards real progress in terms of high‐precision positioning, high resolution, high throughout, higher stability, facile processing, and lower‐cost production.
Recent advances in top‐down and bottom‐up patterning of conducting polymers on surfaces using ‘add‐on’ processes such as direct writing, in‐situ syntheses or assemblies, and ‘subtract‐from’ processes such as etching and nanoscratching are summarised. These processes make possible high‐precision positioning, high resolution, and considerable throughout. The most promising applications of the patterned conducting polymer devices with enhanced performance and new properties are also introduced.

Url:
DOI: 10.1002/smll.201002356


Affiliations:


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